1 A and 2 A Devices Feature Low 0.65 mm Profile and Forward Voltage Drop Down to 0.36 V
MALVERN, Pa. — July 19, 2017 — Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its offering of surface-mount TMBS® Trench MOS Barrier Schottky rectifiers with 10 new 1 A and 2 A devices in the eSMP® series MicroSMP (DO-219AD) package. Providing space-saving alternatives to Schottky rectifiers in the SOD123W, the Vishay General Semiconductor devices feature reverse voltages from 45 V to 150 V and include the industry’s first 2 A TMBS rectifiers in the MicroSMP to deliver forward voltage as low as 0.40 V.
Currently, Schottky rectifiers with current ratings to 2 A are typically available in the SOD123W and SMA packages. The devices released today increase power density by offering this high forward current in the smaller MicroSMP. Measuring 2.5 mm by 1.3 mm with a low 0.65 mm profile, the package is 35 % thinner than the SOD123W while occupying 45 % less board space. For excellent thermal performance, the MicroSMP features an asymmetric leadframe design.
With their forward voltage drop down to 0.36 V for 1 A devices and 0.40 V for 2 A devices, the rectifiers reduce power loss and improve efficiency in low voltage, high frequency inverters, DC/DC converters, and freewheeling and polarity protection diodes for commercial and industrial applications. The devices are also available in an AEC-Q101 qualified version for automotive applications.
The new rectifiers feature a maximum operating junction temperature up to +175 °C and an MSL moisture sensitivity level of 1, per J-STD-020, LF maximum peak of +260 °C. Ideal for automated placement, the devices are RoHS-compliant and halogen-free.
