Robust Interconnect Protection Helps Advance Cu Pillar Flip-Chip Designs
July 8, 2014 – Expanding on its market-leading underfill portfolio, The Electronics Group of Henkel has developed a new non-conductive paste (NCP) material, LOCTITE ECCOBOND NCP 5209. Designed to enable the move toward fine-pitch flip-chip architectures, LOCTITE ECCOBOND NCP 5209 delivers comprehensive underfill protection that overcomes the challenges associated with conventional capillary underfill materials.
“The demand for higher-function, miniaturized devices is driving packaging specialists toward fine-pitch flip-chip designs,” explains Matt Hayward, Semiconductor Liquids Global Product Manager for The Electronics Group of Henkel. “To enable this shift, new flip-chip bump technologies such as copper pillar are increasingly being employed because of their adaptability for ultra-fine pitches and better electrical connections. The reality is, only NCP can deliver the protection required within such tight dimensions.”
