GARDEN GROVE, CA ― July 2015 ― Metcal today announced plans to exhibit in Booth B-1G26 at NEPCON South China, scheduled to take place Aug. 25-27, 2015 at the Shenzhen Convention & Exhibition Center. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be on display, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.
The Scarab ensures accurate and repeatable cleaning of the component pad in one user-friendly system. It redefines performance and addresses the technical demands presented by component manufacturers today. Additionally, the Scarab addresses the industry needs with an automated system capable of cleaning components pads without contact.
Reworking small chip components such as 01005, 0201, 0402 and 0602s can be difficult and require specialized tools. Metcal has developed a technique and identified a selection of tools that enable the operator to rework these small components with repeatability and consistency. Metcal will display the new solder ball placement kit to meet these challenging applications.
The success of conduction soldering depends upon the availability and controlled flow of thermal energy into the connection during two critical phases – flux activation and intermetallic bond formation. To meet these higher thermal demands, Metcal will display the new dual cartridge hand-piece and work stand along with a series of five new dual-shaft cartridge geometries.
For more information about any of Metcal’s bench tool solutions, visit www.metcal.com.
