- Mentor Xpedition High-Density Advanced Packaging (HDAP) Flow
the first comprehensive solution for the design and verification of modern IC packages. - Industry-unique Xpedition substrates Integrator tool enables rapid prototyping of packages with heterogeneous substrates.
- The new Xpedition package design technology for the physical implementation of packages ensures data synchronization reliable signoff and verification of designs.
- Integrated Mentor HyperLynx technology offers 2.5D / 3D simulation models and design rule check to identify design errors before tapeout and fix it.
- The Caliber 3DSTACK technology enables complete signoff verification of a variety of 2.5D and 3D stacked die configurations.
Mentor, a Siemens company, which provides Xpedition High-Density Advanced Packaging (HDAP) Flow the most comprehensive, productive solution for the design of modern IC packages. This integrated solution combines the Xpedition-, HyperLynx- and Caliber technologies from Mentor and covered by the rapid prototyping to signoff of the GDS data from everything. The new Mentor IC package design flow provides faster and higher quality results compared to existing HDAP methods and technologies. The Xpedition HDAP design environment provides early, rapid and accurate “what if” or more prototypes and this existing in a few hours as opposed to days or weeks compared to tools or processes. It thus enables the analysis and optimization of HDAP designs prior to detailed implementation.
By modern packaging technologies such as fan-out wafer level packaging (FOWLP), the worlds of IC design and packaging approximate. This represents traditional design methods with new challenges and promotes the demand for new, efficient processes, methods and design tools. Existing tools are inefficient and often fail if the designs are transferred to production. Mentor solves this problem with a HDAP solution, which includes the creation of prototypes with a plurality of substrates and the detailed physical implementation with verification and signoff on Foundry / OSAT level.
“FOWLP learns from 2015 to 2020 an enormous growth rate of 82 percent,” said Jan Vardaman, president of TechSearch International, Inc. “However FOWLP is disruptive for the traditional design and manufacturing chain. As with other advanced high-density packaging technologies, the technology requires the joint design of ICs and packages as well as new flows as the Mentor HDAP solution.”
Unique technology for HDAP integration, prototyping and package design
The new HDAP flow introduces two exceptional technologies. The first, the Xpedition substrates integrator tool is a graphical environment for rapid virtual prototyping, analyzes the heterogeneous ICs with interposers, packages and printed circuit boards and integrated. In order to achieve optimal connectivity, performance and manufacturability, the tool made possible by a rule-based method provides a fast, predictable development of prototypes with the full cross-domain substrate system. The second new technology is the Xpedition package designer tool, a complete solution for the GDS issue, to mask creation ranging from design and manages the physical implementation of the package. The Xpedition package designer tool uses before signoff integrated HyperLynx® design rule check (DRC) for detailed testing of the design and HyperLynx® Fast3D package solver helps to create the package models. The direct integration with the Caliber tool then allows process design kit (PDK) signoff.
Integrated HyperLynx® technology for design review
The Xpedition HDAP flow integrates two mentor HyperLynx® technologies for 3D signal integrity (SI) and power integrity (PI) and the design rule check (DRC) at the process level. Package designers can simulate using the HyperLynx® FAST 3D Field Solver 3D SI / PI models for extraction and analysis. The HyperLynx DRC tool identifies and fixes easily DRC error at substrate level and typically takes 80 to 90 percent of the problems before the final tape-out and signoff verification.
Caliber technology 3DSTACK
Integrated with the Xpedition package designer tool Caliber-3DSTACK technology allows physical verification of 2.5 / 3D packages. IC package designers can a complete system with multiple “This” check at each process node respect signoff DRC and layout versus schematic (LVS), without having to interrupt current tool flows or the need for new data formats, what time to significantly reduce the tapeout.
OSAT Alliance Program
Mentor has also launched the outsourced assembly-and-test (OSAT) Alliance Program. This is a global design and supply chain resource that fabless customers facilitates the use of the new HDAP technology. The OSAT Alliance Program includes proven design flow, tool kits and best practices for verification and signoff processes with which HDAP projects with high-quality results can be achieved.
“Recognized combines the new Xpedition HDAP solution from Mentor, industry-leading technology from Xpediton, HyperLynx® and Caliber,” said AJ Incorvaia, vice-president and general manager of Mentor’s Board Systems Division. “Companies are looking for a proven solution for focused FOWLP, combining the foundry and OSAT design and manufacturing signoff support. The Xpedition HDAP flow provides our customers with a unified design and verification environment for production-oriented designs.
