World’s first full-feature wearable chipset combines dual-mode Bluetooth Low Energy, GPS, MIPI-supported high-resolution screen
TAIWAN, Hsinchu– January 5, 2016 – MediaTek today announced the MT2523 series. Designed for active and fitness smart watches,it is the world’s first system-in-package (SiP)to offer GPS, dual-mode Bluetooth Low Energy, and a MIPI-supported high-resolution mobile screen.
The MT2523 combines long battery life, high-quality display technology, and small chip sizeto provide for optimum user experience. The SiP’s printed circuit board area is 41 percent smaller than competitors’ solutions. In comparison to other wearables, devices powered byMT2523 can last more than a week on one battery charge.
“The MT2523, with its combination low power and rich features, marks a significant step forward for the smart watch and wristband industries, said JC Hsu, MediaTek’s corporate vice president and general manager of IoT business unit. “Power combined with efficiency has always been the hallmark of MediaTek technology solutions and we are leading the charge in bringing this know-how to IoT products.”
MediaTek’s MT2523 product family is based around a highly integrated system in package (SiP) that contains a micro controller unit (MCU), dual-mode Bluetooth, GPS and a power management unit (PMU). The MCU enables wearable devices with lower power consumption and smaller form factors than Android Wear. The display component supports MIPI-DSI and serial interfaces, resulting in a high-resolution mobile screen. It includes 2D capabilities of true color, per pixel alpha channel and anti-aliasing fonts, plus 1-bit index color to save memory and computing power. MT2523’s low power comes from its ARM® Cortex®-M4 processor, which combines high-efficiency signal processing functionality with low power, low cost and ease-of-use benefits.
Details about the MediaTek 2523 can be found at [http://www.mediatek.com/en/news-events/mediatek-news/mediatek-announces-mt2523-series-designed-for-smart-watches/].The SiPwill be available to device makers starting in the first half of 2016.
