(Waterbury, CT USA) – August 22th, 2019 – The assembly division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper “The Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys“ at the SMTA China South Technical Conference on August 28-29, 2019.
Low temperature assembly processes are continuing to rise in popularity throughout the electronics assembly industry and Sn-Bi based alloys act to enable this transition. Reduced temperatures bring a sum of benefits: minimized expansion/shrinkage due to CTE mismatch, reduced dynamic warpage, lower thermal stress of sensitive materials, and energy conservation for environmental conservation. At elevated temperatures, mismatched coefficients of thermal expansion cause added stress on the solder joint. Strain loads can result in solder joint degradation and may lead to joint failure due to crack propagation through the solder joint fillet. To overcome these challenges, MacDermid Alpha employed new low-temperature alloys and chemistry platforms for the introduction of novel low-temperature solder pastes. The new alloy discussed in this technical paper (X46) is a Sn-Bi system with micro-additives that further improves the base alloy properties, resulting in performance similar to SAC305. In this paper, Annie Yang will focus on addressing the mechanical performance of the joint which is characterized using a shear test for passive components.
Annie Yang, Regional Marketing Manager, will present at 11:05am on Thursday, August 29th at the SMTA China South Technical Conference. Meet her at Booth 1A80. Hall 1, Shenzhen Convention & Exhibition Centre, Shenzhen, China. For more information on Alpha’s Low Temperature Technology, visit MacDermidAlpha.com or contact Annie.Yang@MacDermidAlpha.com
