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Home Electronics News

Koh Young Highlights Latest Technology at SMT Hybrid Packaging Show

Electronics Maker by Electronics Maker
May 26, 2017
in Electronics News
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Seoul, South Korea — 3D inspection technology leader Koh Young Technology showed off its latest technology developments, including the KSMART Solution, Koh Young’s own field-proven AI platform – IP (Intelligent Platform) at the recent SMT Hybrid Packaging 2017 Show in Nuremberg, Germany. The exhibit was timely in part because Koh Young has proven the excellence of KSMART in Germany, the industrial powerhouse where the “Industry 4.0” concept first emerged, according to Wolfgang Runte, Sales Manager of Koh Young Europe.

“At Koh Young Technology, we’ve been promoting a new theme, ‘True 3D Now Powered by IP’,” Runte said. “The new KSMART features that we’ve unveiled are based on IP, enabling Smart Factory realization. With KSMART, by using reliable full 3D measurement data, we’re tracing and analyzing defect root causes earlier than ever before.” Key features of the KSMART solution that were highlighted included Link@KSMART, SPC@KSMART, and Library Manager. Another new feature for 3D Automated Optical Inspection (AOI), based on IP, is Auto Programming, which reduces the time needed to create new JOB files. Attendees also had the opportunity for a sneak preview of advances in Koh Young’s inspection technology, and of new developments especially designed to serve the Automotive industry.

SMT Hybrid Packaging is the only event in Europe that takes a comprehensive view of microelectronics, bringing together 420 exhibitors and more than 15,000 visitors.

Tags: SMT Equipmentstest and inspection
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