SMT Hybrid Packaging 2016
BANNOCKBURN, Ill., USA, March 08, 2016 — IPC’s Hand Soldering Competition at SMT Hybrid Packaging 2016 will see skilled competitors go soldering iron to soldering iron, April 26-28, as they compete for cash prizes and a coveted spot at the IPC Hand Soldering World Championship at IPC APEX EXPO® in San Diego in 2017.
Hand soldering of high density printed boards demands highly skilled operators to ensure a zero-defect soldering process, and this contest — IPC’s annual competition at SMT Hybrid Packaging — will recognize the best skills in hand soldering complex printed board assemblies. Over three days, participants will compete against each other to build a functional electronics assembly within a 60-minute time limit. Assemblies will be judged on soldering in accordance with IPC-A-610F Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. IPC-A-610 Master Instructors will serve as judges.
The IPC Hand Soldering Competition winner and two runners-up will each earn cash prizes: 1st place — €300; 2nd place — €200; 3rd place — €100. In addition, the first place winner will earn a chance to compete against the best hand soldering technicians from around the world at the IPC World Championship at IPC APEX EXPO® in San Diego, in March 2017.
