SMT industry is growing in India and getting more & more application specialized. The more the special an application will be more it has to be accurate. For an accurate SMT process error elimination is essential. Continuous inspection & monitoring could be the first step in error elimination. In SMT process inspection can be done simple by optical vision or complicated processes are available like X-Ray for sophisticated cased like multilayer layers. Commercial X-Ray & AOI (Automatic Optical Inspection) are now a day very common in SMT lines. In this article we have bought to you some of the SMT inspection machines available in India industry.
Unlike stencil printer, pick & place machines & reflow ovens, SMT inspection machines evolves quite later in Indian SMT industry. The SMT inspection systems could be an X-Ray inspection system, an AOI (Automatic Optical Inspection) or could be Solar Paste Inspection systems. The SMT inspection machines can be categories as follows:
- AOI Equipment: including 2D and 3D inspection equipment.
- X-ray Inspection Equipment: including manual X-ray inspection (MXI) equipment, semi-automatic, and automatic X-ray inspection (AXI) equipment
- SPI Equipment: including 2D and 3D inspection equipment.
The global surface mount technology (SMT) inspection equipment market generated a revenue of $X million in 2012. The market is expected to grow at a CAGR of X% from 2012 to 2019, reaching
$X million in 2019.
Major market segmentation for includes, Consumer electronics, Computing and storage, Telecom, Automotive, medical, aerospace and defense , industrial, and green technology. The evaluation of inspection systems, have bought accuracy & preciseness in the SMT process. These systems were evolve in Indian industry in early 20th century have seen a vast growth thanks to the changing trend in the SMT industry. SMT inspection equipment manufacturers have focused on improving gantry systems and ensuring that mechanical designs and algorithms are robust. Other areas of innovations are architecture, stack ability, and measurement capacity. The automated optical inspection (AOI) equipment segment is facing declining prices and high competition. As a result, while there is increased demand for unit shipments, overall revenue growth is expected to be nominal. The solder paste inspection (SPI) equipment segment is benefiting from an increased need to ensure X% solder deposit accuracy and identify head-in-pillow and other defects. The demand for continuous process improvement elevated the demand for SPI equipment. Maturing technology is another challenge in the AOI equipment segment. Therefore, new competitors can easily present their own technology and value differentiation.
Some of the major brands available in India industry
RV1 inspection system from Juki India
Launched in May 2014, RV1 is a high speed, 0.14 seconds/frame inspection machine. It offers high precision inspection by capturing super clear images using a large sized ring light and coaxial light. It is easy to operate because of its newly developed ‘template mode”. Key features are, Clear vision capturing system, Easy programming, CCC (central confirmation control), SPC (statistical process control), Supports 3D inspection, PWB size: 50 mm×50 mm-510 mm×300 mm (double lane)/ 50 mm × 50 mm-510 mm × 590 mm (single lane), Power supply: AC 3-ph 200-230V 2.0 kVA/ 0.49 MPa 10 NI/min, Dimensions: Width: 940 mm, depth: 1975 mm and height: 1530 mm, Components: 0402*, 0603 (metric), cylindrical chip, tantalum capacitor, transistor, SOP/QFP, etc, Inspection speed: 0.14 seconds/frame, Resolution: 15μm (standard resolution), 10 μm (high resolution).
Nordson DAGE’s award winning X-ray inspection systems
Nordson DAGE’s award winning X-ray inspection systems have been specifically designed for the printed circuit board (PCB) and semiconductor industries, offering sub-micron imaging capabilities in both failure analysis laboratories and production environments. The new Xi3400 Automated X-ray Inspection System (AXI) offers complete 2D and 3D inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors, Ideal for in-line and off-line applications.
Nordson YESTECH’s AOI systems
Nordson YESTECH’s AOI systems bring powerful, cost-effective yield enhancement solutions to the electronics market. The new Nordson YESTECH FX-940 features advanced 3D technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part / polarity, through-hole parts, and co-planarity of chips, BGAs and other height sensitive devices. By combining Fusion Lighting with a comprehensive set of inspection tools, including angled cameras, 3D height sensors, full colour digital image processing, and both image- and rule-based algorithms, the FX-940 is unsurpassed in defect detection.
3D AOI, and X-ray systems from Viscom, Germany by Innotronics Systems
German based Viscom is the most renowned provider of cutting edge 3D AOI, and X-ray solder paste, component placement and solder joint inspection equipment in the PCB assembly industry. Offering highly precise and cost-efficient inspection solutions and with 30 years of experience Viscom earned the reputation as the most innovative and reliable partner to the world’s leading electronics companies. Viscom systems ensure quality and efficiency in surface mount technology production lines, where they can be interlinked to further improve productivity.
X-Scope 1800 from Scienscope International by DVS India
Scienscope’s X-Ray inspection systems division offers state of the art X-ray cabinet systems with the highest performance to price ratio in the industry today. Our best seller model X-Scope 1800 is a general purpose, high resolution, fully programmable x-ray system designed to address the nondestructive testing needs for failure analysis, research and development, process development, process monitoring and the ongoing support of electronics assembly, rework and repair. The X-Scope 1800 is a “batch” or manual type of x-ray system and includes a Windows based PC workstation with multiple image processing functions for real time measurement and data collection.
BF-Comet18 inspection system from SAKI Corporation by DVS India
BF-Comet18 for M-size board inspection is designed for high volume manufacturing. This model has 18µm resolution and high-speed scanning hardware. Solder fillets on components as small as the high density mounted 0603 (0201) chip, as well as IC’s with 0.4 mm pitch lead are easily inspected and analyzed. Also, BF- Comet18 has newly designed LED lighting unit that enables highest throughput of PCBA inspection. Key features are High productivity & Compact Body, resolution: 18um, High throughput, Coaxial Overhead Light, Flexibility and Inspection Categories: Presence/Absence, Misalignment, Tomstone, Reverse, Polarity, Bridge, Foreign material, Absence of solder, Insufficient solder, Lifted lead, Lifted Chip, and Fillet defect.
Yamaha 3D X-Ray Machines by Trans Technology
Yestech, Nordson (USA) new 3D AOI Model- FX940: Advanced AOI machine for next generation inspection requirements for medium to high volume production. 9 megapixel colour imaging, Capture on the fly technology, 1 top-down and 4 side angle cameras, Quick set-up, High defect coverage / low false failure & Optional 3D inspection. 20” x 21” (500 mm x 525 mm) Standard PCB Size, Image resolution – 4096 x 2160; 25, 12 or 8 micron pixel. Size & Up to 30 sq. in. /sec. > 1.5 million components per hour.
Yamaha 3D X-Ray Machine Design for critical PCB Assemblies, YSi-X by Trans Technology
Ideal for 100% inspection of on-board automotive products and many other items by 3D X-rays Acquire Layered of Target
Select the type you need X-ray detector, TYPE A (High resolution type) or TYPE B (Long service life type) Switchable Tube voltage 130 KV (on-board vehicle use), 110 KV (household use), 70 KV (device use) X-ray, optical, infrared, and laser height measurement as standard equipment. Hybrid and High Reliability with Multiple Inspection Modes.
Conclusion
The X-ray inspection equipment segment is expected to benefit from rapid adoption globally, especially from end verticals such as consumer electronics, computing and storage, telecom, and automotive. Tablets and other smart products are becoming dense and populated and are capable of increased multitasking in communication and entertainment. As product requirements increase, the demand for high quality assurance in the production environment is rising. In most cases, electronics manufacturers adopt x-ray inspection for sample tests. However, as boards become more complex and double sided, the demand for x-ray equipment will increase throughout the forecast period.
