Karthik’s presentation, Solder TIMs (Thermal Interface Materials) for Superior Thermal Management in Power Electronics, discusses indium-containing TIMs developed specifically for high-power applications and their performance compared to thermal grease. Indium Corporation’s patented Heat-Spring®, a foil made of indium and indium-containing alloys, was tested against thermal greases. In all tests, the Heat-Spring® consistently outperformed thermal grease by achieving lower power die temperature, preventing the power die from overheating. This outcome was achieved by improving thermal interface conductivity (reducing thermal interface resistance), especially over time.
More details about the show and the technical program can be found in the conference program.
Karthik is based in the UK and is responsible for Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at industry forums and conferences internationally.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com