Indium Corporation will feature its unique solid/liquid hybrid thermal interface materials—m2TIMTM—at the Semi-Therm Thermal Technologies Workshop, Nov. 4-6, Redmond, Wash.
Indium Corporation’s m2TIMTM combines liquid metal with a solid metal preform to provide reliable thermal conductivity for heat dissipation without the need for a solderable surface. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.
Other m2TIMTM benefits include:
- Availability in a variety of alloys, including InGa and InGaSn
- Extraordinary wetting ability to both metallic and non-metallic surfaces
- Extremely low interfacial resistance at surfaces
- Eliminated risk of pump-out of the liquid alloy due to absorption by solid solder preforms
For more information about Indium Corporation’s full line of thermal interface materials (TIMs), visit www.indium.com/TIM.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or
