Indium Corporation will feature its fine-grade precision die-attach AuSn ribbon at NEPCON Japan, January 15-17 in Tokyo, Japan.
AuLTRATM-FINE die-attach AuSn ribbon is designed for high-volume, fully-automated laser diode assembly. Indium Corporation’s precision, high-volume production lines can produce AuLTRATM-FINE ribbons as small as 0.254mm (0.010”) wide by 0.0152mm (0.0006”) thick.
The ribbon delivers excellent edge quality with no warping or bends, and is packed on high-quality spools designed specifically for automated laser diode assembly. Indium Corporation is capable of producting spools >15 meters of continuous length.
For more information about Indium Corporation’s precision gold products, see our experts at the show at booth #ISP2-0407 or visit www.indium.com/gold.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
