Indium Corporation’s Graham Wilson, applications engineer, will present at IMAPS UK Heat of the Matter (HtM) Technical Conference, Oct. 23 at the University of Oxford, U.K.
Thermal interface materials (TIMs) play a critical role in transporting heat away from the power die within high-reliability, high-power applications, increasing functionality and the life of the power module. Wilson’s presentation, Thermal Interface Materials in High-Reliability Applications, will include the results of a performance comparison between Heat-Springs® and thermal grease, PCMs, and graphite. Criteria reviewed in this study included bake test, power cycling, changes in interface resistance and solder thickness, and thermal cycling.
Wilson supports European-based customers with comprehensive technical advice on the selection, use, and application of solder paste, flux, and engineered solders. His expertise spans a number of industries, including electronics assembly, optoelectronics, thermal management, semiconductor packaging, and more.
HtM is organized by IMAPS-UK and the University of Oxford, and sponsored by Indium Corporation. This event brings together developers, manufacturers, end-users and supply chain companies to promote business opportunities in the advanced high-temperature electronics sector. For more event information, visit uk.imapseurope.org.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com
