Indium Corporation will introduce Indium10.5HF, a new halogen-free, Pb-free solder paste at the IPC APEX Expo Feb. 24-26 in San Diego, Calif.
Indium10.5HF is a no-clean solder paste designed to improve ICT first-pass yields. It is specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry.
Indium10.5HF solder paste has a soft, pliable, non-tacky residue that minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields. Indium10.5HF offers unprecedented stencil print transfer efficiency, making this solder paste suitable in the broadest range of processes. It also provides excellent head-in-pillow performance. Indium10.5HF solder paste saves time and increases output for companies that require ICT as part of their normal production.
“This solder paste is ideal for customers in a wide range of markets, including automotive, medical, computing, communications, and aerospace/military,” Glen Thomas, product manager, PCB solder paste said. “Additionally, many of our customers have reported improved wetting and solderability for their applications, especially for RF shield-attach.”
For more information about Indium10.5HF or Indium Corporation’s complete Pb-free Solder Paste series, visit us at APEX in booth #1027, online at www.indium.com/APEX-2015, or email askus@indium.com.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
