Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at the Applied Power Electronics Conference (APEC), March 15-19 in New Orleans, La., USA.
Indium Corporation’s solder and thermal solutions for power electronics include the following:
- InFORMS® reinforced solder alloy fabrications improve mechanical and thermal reliability while ensuring uniform bondline thickness. They also address specific challenges of the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- QuickSinter® silver sintering paste delivers consistent, high-speed sintering on a variety of surfaces and die metallizations. QuickSinter works well in both high- and low-temperature pressureless applications. It can be used for discretes, small modules, and integrated power modules.
- Metal thermal interface materials (TIMs) are available for a wide variety of applications and process challenges. Our Heat-Spring® TIM offers uniform thermal resistance with minimized surface resistance and increased heat flow. The HSMF is a compressible TIM that is ideal for large area thermal interface requirements, such as IGBTs.
For more information, visit Indium Corporation’s experts at the show at booth 1905.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.