Indium Corporation’s Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the CEIA Guiyang Seminar on July 26 in Guiyang, China.
Liang’s presentation, How Solder Materials Influence Reliability, will review how materials can be used to solve some of the top industry challenges including head-in-pillow, non-wet opens, graping, and SIR performance. He will also discuss what materials to use to ensure the high reliability of the final assembly and share the methods and test results of high-reliability alloys.
Indium Corporation will also be exhibiting at the seminar. Their booth will feature their high-reliability, low-voiding products, such as Indium8.9HF Solder Paste, Indium10.1HF Solder Paste, and precision gold-tin preforms. Technical experts will be available at the booth to answer questions about the presentation and help resolve customers’ assembly challenges.
Liang provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has more than a decade of experience in surface mount technology.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.
