Indium Corporation’s Chris Nash, Product Manager, PCB Assembly Materials, will participate in a Global SMT & Packaging voiding panel on Tuesday, Sept. 8 at 10:45 a.m. Eastern Time (3:45 p.m. British Time/10:45 p.m. Malaysia Time).
Voiding under bottom termination components (BTCs) is a major industry challenge. As BTCs generate considerable amounts of heat during operation, it’s important to ensure voids do not form during reflow soldering, as they could potentially cause end-product overheating and field failures. During this panel, Is the Void Avoidable?, experts will examine the many approaches available to limit and mitigate the effects of voiding. The panel will be followed by a live Q&A session.
For more information or to register for the debate, visit https://bit.ly/3fzSbvV.
If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at www.indium.com/webinar.
Nash is the Senior Product Manager for Indium Corporation’s PCB Assembly Materials. With an intimate understanding of customer needs and challenges, he works closely with the company’s R&D team to deliver fully scaled, launched, marketable product solutions for the PCB assembly market. He also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers. Nash joined Indium Corporation in 2005. He has authored several process and technical guidelines and has presented at numerous industry forums and conferences. He is a member of the SMTA and participates in the IPC standards development committee.
Nash has a bachelor’s degree from Clarkson University. He is certified as a Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering and is a Certified SMT Process Engineer.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
