Indium Corporation continues to develop innovative solder paste solutions to fit customers’ needs. PicoShot™ NC-5M is designed for customers needing a no-clean halogen-free SAC305 solder paste for their Mycronic jetting systems or add-on and repair modules.
PicoShot™ NC-5M jetting solder paste is the first material to come out of Indium Corporation’s new partnership with Mycronic, a global leader in dispensing and jet printing equipment.
PicoShot™ NC-5M is a no-clean halogen-free solder paste approved after joint Indium/Mycronic technical development with Mycronic’s MY 600/700 jetting systems. PicoShot™ can be used in standalone applications, such as system-in-package (SiP), jetting into cavities, stencil-replacement, shield attach, and microBGA. It also complements the stencil printing of Indium8.9HF. Designed as a no-clean solder paste, PicoShot™ can be cleaned easily with industry standard cleaning solutions.
PicoShot™ NC-5M’s formulation meets or exceeds:
- ANSI/IPC J-STD-004B ROL0 requirements
- Halogen-free requirements per IPC and IEC61249-2-21 standards
- IPC standards for SIR and ECM
Additionally, PicoShot™:
- Provides exceptional jetting performance for a halogen-free Pb-free solder paste
- Reflows in air or nitrogen (ppm O2 level from 50-1,000)
- Has a clear residue with minimal flow-out
- Significantly reduces of head-in-pillow (HIP)
- Eliminates or significantly reduces graping
- Minimizes reflow spatter
Indium Corporation also offers a PicoShot™ NC-5M conditioner (purging gel) designed to allow the rapid purging, cleaning, and long-term storage of jetting, dispense, and microdispense systems without the use of liquid solvents. PicoShot™ Conditioner C-1 is a chemically benign, bright blue-colored translucent, viscous gel that aids in visual endpoint detection and prevents inconsistent dispense volumes and clogging caused by solder paste dry-out.
To learn more about Indium Corporation’s new jetting paste, visit https://www.indium.com/
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
