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Importance to be given towards international exposure, knowledge sharing, creation of conducive business environment for the members of both the associations;
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MoU to also enable either of the association to jointly promote the interest of semiconductor subjects, pertaining to Indian and Japan markets
Bangalore, December 3, 2015 – India Electronics and Semiconductor Association (IESA), the premier trade body representing the Indian Electronic System Design and Manufacturing (ESDM) industry, today signed a Memorandum of Understanding (MoU) with Asia Semiconductor Trading Support Association (ASTSA) with an objective to promote ESDM industry co-operation between India and Japan.
The concerned MoU is a part of delegation who visited Japan to explore the possibilities of doing business in JAPAN and promote collaborations for the Indo-Japan ESDM industry. The delegation led by IESA, includes leaders and potential investors who would like to expand their business in Japan as well as seek similar interest to expand mutual business through collaboration between Japan and India.
The MoU would enable IESA and ASTSA to promote ESDM ecosystem in Indian and Japan and strengthen business relationship among the member companies. The engagement would also provide an opportunity to the member companies of the both the associations to jointly work towards a mutually beneficial activity in the ESDM landscape and empower knowledge exchange and sharing among them.
Commenting on the collaboration, Mr. M. N. Vidyashankar, President, IESA said, “Japan has already established itself as a global leader in the ESDM landscape. India is gaining momentum to establish its identity in the space and we believe, the MoU will help both the nations to expand bilateral trade.”
“India is emerging as the fascination for many global ESDM leaders primarily due to its mature market, availability of talents and the expertise India can bring to the ESDM supply chain with components like designing, embedded system, VLSI etc. We believe India’s ESDM industry is at an inflection point and the MoU can only strengthen our commitment towards each other” said Dr. Hajime Tomokage, President ASTSA (Asian Semiconductor Trading Support Association)
As defined in the MoU, both IESA and ASTSA are committed to work together on the ESDM ecosystem and collaborate to develop stronger ties between India and Japan by creating business opportunities.
Apart from the MoU signing, the delegation visit would also involves exclusive B2B interaction with leaders of the manufacturing and semiconductor industry and a visit to JETRO (Japan External Trade Organisation), Fukuoka and an event on Embedded Technology at Yokohama, Japan.
