512Kbyte STM32F3 MCUs from STMicroelectronics Raise the Bar in System Integration
New devices extend the STM32F3 mixed-signal series New Delhi, January 30, 2015 – STMicroelectronics has extended its STM32F3 microcontroller series...
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LabVIEW Communications provides a seamless path from algorithm to prototype, helping designers innovate faster.
Mr. Satish Mohanram, Technical Marketing Manager, National Instruments NI the provider of solutions that enable engineers...
Telit Debuts Three New Positioning Modules with Embedded Antenna
Compact Jupiter SE868-A and SE868-AS modules offer choice of constellation support, RF optimization and low power consumption, while robust SC872-A...
Electrolube to launch New Coating and Resin Products at EFY Expo India
Electrolube’s newest advancements in conformal coatings and encapsulation resins will take centre stage at the EFY Expo Western India, which...
SolderStar Announce a New Sales and Support Partner in Spain
SolderStar Ltd, specialists in the design, development and manufacture of thermal profiling equipment for the lead-free electronics industry, has announced...
MapR Unveils Free On-Demand Training Program with $50M In-Kind Contribution to the Hadoop Community
Self-service, comprehensive curriculum fulfills Hadoop certification requirements New Delhi, January 29, 2014 –MapR Technologies, Inc., provider of the top-ranked distribution...
Panasonic combines latest Intel technology with product line longevity in Toughbook and Toughpad range
BRACKNELL, UK. 29TH JANUARY 2015 - Panasonic announced that the latest versions of its Toughpad FZ-G1 and Toughbook CF-31 will...
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