In context of the 50th anniversary of the leading electronics show in Europe, the Jena-based company GOEPEL electronics will showcase a wide range of its products for optical and electrical measuring and testing technologies. At booth A1.351, visitors can experience how one-stop JTAG/Boundary Scan and optical inspection (AOI/AXI/SPI) allows complete test coverage with ease of operation.
One main focus at the booth of GOEPEL electronics will be the AOI division, represented by two systems: the solution for high-end inspection in large scale production which bears the name TurboLine. Double-sided inspection without assembly turning and rotatable angled-view are the factors for an even faster testing. That shadows no longer pose a problem will be shown by the AdvancedLine•3D. The integrated sensor module 3D•EyeZ enables true 3D measurement of solder joints and components free of shadows. The associated software PILOT 6.0 makes the operation of the systems more comfortable than ever before.
The 3D X-ray inspection will be represented on the electronica by the X-Line 3D, the system for high-end in-line inspection. The intelligent combination of automatic X-ray (AXI) and automatic optical inspection (AOI) combines the advantages of both technologies. Thus, an almost 100 percent visual inspection depth in one system (AXOI) is possible, resulting in significant savings compared to single systems. Likewise three-dimensional is the inspection of solder paste by the SPI-Line 3D, which will be presented to the visitors.
The JTAG/Boundary Scan division of GOEPEL electronics will come up with a variety of innovative technologies and new product developments to support the Embedded System Access (ESA) on components and assemblies for test, programming, validation and emulation tasks.
For the first time GOEPEL electronics will present the support of ChipVORX and VarioTAP technologies for Altera SoC (System-on-a-Chip). The extremely powerful FPGAs named Cyclone V and Arria V have two ARM Cortex-A9 cores to design complete systems, integrated in a compact BGA package without physical access. By using the ChipVORX and VarioTAPtechnologies, users can solve this access problem. These embedded instruments allow testing, debugging and programming of Flash devices.
Furthermore GOEPEL electronics will introduce an I/O module for test and design validation of PCI Express interface cards. This solution provides a PCIe x8 slot and supports the IEEE 1149.1 and IEEE 1149.6 Boundary Scan standards as well as a Bit-Error-Rate-Test (BERT) of the PCIe interface. Thus, the I/O module gives the ability to verify and test prototypes of new PCIe plug-in cards by non-invasive techniques comprehensively.
Third novelty will be the Rapido RPS910 – a new generation of on-board programming of non-volatile memories with test option. The further development of the proven in-system programming technology now has a larger band module which supports the input buffering of boards with width up to 400 mm, hence reducing handling times. Numerous electrical and mechanical optimizations, variable adaptive band speed and the self-test function make the Rapido RP910 an all-round multi-site inline programmer. In addition, the model RPS910-32 is designed for parallel processing of up to 32 UUTs. The newly developed hardware concept allows parallel programming of different targets on one assembly.
