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Future technologies – optical bonding and curing on demand

Electronics Maker by Electronics Maker
July 20, 2015
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RAMPF Technology Days 2015: Experts discuss innovative solutions for all aspects of processing liquid plastics / New DC-CNC250 desktop dispensing cell presented

Zimmern o. R., July 20, 2015. The latest issues and future challenges relating to innovative solutions for process optimization in processing liquid plastics were at the heart of the RAMPF Technology Days 2015, a two-day specialist conference held in Rottweil, Germany. As key technologies of the future, there was intense discussion on optical bonding and curing on demand.

The RAMPF Technology Days 2015 featured outstanding presentations by big-name users, material manufacturers, and system partners such as BROSE, KUKA Roboter, and SMA Solar Technology, as well as opportunities for the 70 participants to share their knowledge and experiences. “We are very pleased with the feedback from participants,” says Bernd Faller, Managing Director of organizers RAMPF Production Systems, a leading provider of systems for processing one-, two-, and multi-component reaction resin systems and automation solutions. “All the presentations and discussions reflected the high technical standards we had set for the event.”

Future technologies – optical bonding and curing on demand

Optical bonding provides the best readabilityVacuum bonding (optical bonding) was comprehensively addressed as one of the most important trends. Bonding two transparent materials using a high-quality optical adhesive (bonding material, e.g. silicone gel) ensures a significant improvement in the optical characteristics of displays, touch glass, and front glass. “By dispensing and joining in a vacuum, the optical bonding process can also be designed in a much more efficient way,” says Hartmut Storz, Director of Sales & Marketing at RAMPF Production Systems. “That’s because the flow properties of the bonding material have no effect on the bonding quality.” Storz stresses that RAMPF sees cycle times of < 25 / piece in the optical bonding process as perfectly possible.

Curing on demand requires the development of intelligent processes and system planning.Another future technology discussed was the integration of COD (curing on demand) into joining tools. IR heating technology enables fast and reliable processes for bonding plastic components and thus the manufacture of highly efficient and cost-effective bonding systems for series production. “The idea is to develop intelligent system concepts while taking account of process times, the amount of equipment, and ergonomic considerations so as to design the perfect process,” explains Storz.

The new DC-CNC250 desktop dispensing cell

It was precisely this COD technology that was showcased for the rapid curing of superimposed adhesive beads during a tour of the RAMPF Production Systems plant in Zimmern o.R. To round off the RAMPF Technology Days, there were also live demonstrations in the AGT foams areas and coil casting using casting materials exhibiting high thermal conductivity.

The new RAMPF DC-CNC250 desktop dispensing cell was also in use during the tour, impressing participants with the highly precise dispensing of minute amounts of 2-component gap filler. The RAMPF DC-CNC250 impresses with its

> integrated control system and material supply,

> static mixing system, and

> high-resolution 15″ touch display with embedded PC.

This solution can process all standard 1- and 2-component pastes, adhesives, and casting materials that have viscosities between 100,000 and 700,000 mPa*s and support static mixing.

 

Tags: Electronics ManufacturingfeaturedSMT Production
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