Thu, Mar 23, 2017 11:00 AM – 12:00 PM EDT
Reworking 01005 or 0201 components is extremely difficult as these are the smallest chips used in mainstream assembly lines today. The components are so small that the operator must use a microscope to remove them by hand.
Special tools and equipment have been designed to help the operator remove and replace these surface mount components. Some of the challenges associated with these components are close proximity, placement accuracy and proper solder volume application.
This webinar will show you how to rework these difficult components by hand as well as on a rework machine. The result is better process control with thermal temperature profiles, and accuracy of placement with correct solder volumes.
Who Should Attend
- Operators that actually carry out the rework on these small components will find it beneficial.
- Process Engineers that are involved in the rework process of PCBs in the factory.
- Production Managers that are responsible for reworked PCBs.
- Quality Manager that set the standard that is acceptable for rework of these surface mount components.
- Process Manger that is responsible for capital equipment purchases within the factory.
What You Will Learn
- How to rework these parts by hand.
- How to rework on a convection rework machine.
https://attendee.gotowebinar.com/register/66308628007453699
Presenter Biography
Paul Wood – Advanced Product Applications Manager, OK International – A Dover Company
Paul Wood is an industry expert in the BGA/CSP/Array package rework arena. With 34 years of service at OK International, Inc., and 43 years experience in the electronics assembly industry, Mr. Wood has used his global experience in rework to keep electronic assembly manufacturers on the leading edge of technology.
Mr. Wood is the Advanced Product Applications Manager for OK International, specializing in new technology rework applications. He is also an expert in working with lead-free advanced BGA packaging rework equipment.
Mr. Wood works extensively with component manufacturers and advanced packaging professionals to find the latest rework solutions, and incorporates new processes for them into the design of their rework systems. Mr. Wood is often asked to present papers and seminars on BGA/CSP rework at conferences worldwide.
Born in Liverpool, England, UK, he has resided in the USA for the past 20 years. Mr. Wood is married and lives in Pleasanton, CA. He is based at OK International’s worldwide headquarters in Garden Grove, CA.
