REELEY, CO — FCT Assembly will exhibit in Booth #221 at SMTA International, scheduled to take place Sep. 30 – Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Company representatives will be on site to answer any questions about FCT’s stencils and its new coating technology.
The NanoSlic® technology significantly improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. In addition, NanoSlic® minimizes bridging and reduces underside cleaning. This technology can be easily evaluated and is compatible with current assembly equipment and processes.
The new NanoSlic® Gold stencil is the next generation of stencil technology developed to address the increasing demands confronting the electronic assembly industry. The NanoSlic® Gold coating is based on a proprietary application process that coats both the underside of the stencil and aperture walls. This robust coating is both highly hydrophobic and oleophobic, which repels solder paste. NanoSlic® Gold is thermally cured and is a permanent coating.
Also on display, FCT Assembly’s Step and Relief Stencils offer variable stencil thickness in specific areas to accommodate reduced volume (step down) or increased volume (step up). The stencils are ideal for controlling paste deposits on PCBs with both standard and fine-pitch SMT as well as intrusive reflow/paste-in-hole components. Steps are chemically etched into the squeegee side of the foil, yet all apertures are laser cut.
For more information, contact your local representative or visit www.fctassembly.com.
