The inline AXI system from GOEPEL electronics now offers an even faster high-end 3D inspection of complex assemblies. The “X40 PLUS” upgrade enables an X-ray inspection speed increase of up to 18 percent.
Optimization the imaging chain in combination with an improved axle system and faster execution of the test algorithms results in significant savings of cycle time depending on the maximum resolution and the board dimensions.As an example, a 216 x 164 mm assembly with more than 8000 solder joints requires only about 40 seconds for complete 3D X-ray inspection.
The X-Line 3D is an inspection system for safe testing of double-sided boards. The three-dimensional X-ray inspection captures both top and bottom sides within a single pass. Based on a real time multi-angle image, recording a complete 3D inspection of the assembly is possible. Integrated reconstruction methods based on digital thomosynthesis enables the defined evaluation of individual layers of the circuit board under test.
The speed increase is possible for all existing X40 Systems of the Series 200 by upgrading.
