DELAWARE, OHIO – February 2016 – Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications.
EMS 618-116 is designed to cure in 30 minutes at 100°C or rapidly at elevated temperatures. EMS 618-116 forms high-strength, high-reliability conductive interconnects.
The EMS 618-116 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications.
For more information about the EMS 618-116 Room Temperature Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
