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Home Electronics News

Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing Solar Modules

Electronics Maker by Electronics Maker
July 21, 2015
in Electronics News
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DELAWARE, OHIO – July 2015 – Engineered Materials Systems, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduced its new EMS 561-403 Low-Cost Snap Cure Conductive Adhesive for stringing applications in crystalline silicon and thin-film solar modules. EMS 561-403 is designed to electrically interconnect solar cells using ribbons.

The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to cell and ribbon metallization during damp heat exposure. Additionally, the conductive adhesive is designed to cure in seconds at 180°C or above to enable fast fixturing of the cells in the stringer. EMS 561-403 is approximately 50 percent lower cost than standard silver filled conductive adhesives.

EMS-561The 561-403 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for photovoltaic applications. For more information about the EMS 561-403 Low-Cost Snap Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.

Tags: Electronics Manufacturing
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