DELAWARE, OH ― March 2017 ― Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
The cured chemistry can withstand harsh environments, including resistance to extreme moisture conditions and corrosive chemicals.
DF35120 is extremely hydrophobic in nature, providing chemical and moisture resistance. It is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 145°C (By DMA Tan Delta) and a moderate modulus of 4.5 GPa at 25°C. DF-35120 is compatible with and can be used in contact with the EMS line of spin-coatable photoresists.
DF-35120 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photoresists formulated for making microfluidic channels on MEMS devices and integrated circuits.
For more information about the DF-35120 negative photo resist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
