CyberOptics’ 3D SPI Systems and CyberConnect™ software deliver real-time, continuous process improvements while reducing rework costs and increasing throughput with the Panasonic NPM Mounters
Minneapolis, Minnesota— September 15, 2014 — CyberOptics® Corporation , a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, announcesthat allof its latest 3D SPI systems are now Panasonic Factory Automation APC (Adaptive Process Control) ready.
The CyberConnect™ program enables CyberOptics’ 3D SPI systems to successfully feed forward accurate X & Y offset data to Panasonic NPM mounters ensuring correct placement of components based on the solder printing position.CyberConnect™ delivers real-time, continuous process improvements while reducing rework costs and increasing production throughput. The feed forward program compliments othervalue-added process improvement packages from CyberOpticssuch as CyberPrint OPTIMIZER (automated print process optimization) and closed loop feedback with leading print vendors.
“We are pleased to be part of the Panasonic Factory Solutions APC program as another example of CyberOptics’ vision to offer process improvements at every stage of the manufacturing process,” stated Dennis Rutherford, VP Sales & Marketing of CyberOptics. ”This is possible only when systems communicate with each other effectively in real time. With the latest trend in component miniaturization, feed forward capability with CyberConnect™plays a critical role in accurate placement of 01005 and 03015 components.”
For more information, visit www.cyberoptics.com.
About Panasonic NPM (Next Production Modular)
The NPM (Next Production Modular) provides an integrated single-platform solution for expanding and evolving electronics assembly needs. In addition to its interchangeable, plug-and-play placement heads, the NPM platform integrates solder paste inspection (SPI), adhesive dispense (ADH), and post placement inspection (AOI).
