Cinch Connectivity Solutions, a Bel group company, (NASDAQ: BELFA and BELFB) and global leader in delivering reliable connectivity solutions, announces the commercial availability of its CIN::APSE® stacking connector series.
CIN::APSE® solderless, high density, stacking interconnects are used for board to board, flex to board and component to board applications. CIN::APSE® stacking connectors are found in applications where a mezzanine style PCB layout is utilized to reduce space and weight. The CIN::APSE® 1.0 mm pitch accommodates high density circuits between boards. The CIN::APSE® mechanical contacts are durable for applications that require several cycles of disconnections for modifications or testing. The mechanical contacts also reduce the need for soldering and subsequent inspection. CIN::APSE® is one the most widely implemented solderless, high speed interconnects in the industry. With a flight proven history, CIN::APSE® stacking connectors are found on military, aerospace and satellite applications worldwide.
As an authorized distributor for Bel, Heilind Asia provides Bel’s products and also value added services. Heilind Asia supports both original equipment and contract manufacturers in all market segments of the electronics industry, stocking products from the industry’s leading manufacturers in 25 component categories, with a particular focus on interconnect, electromechanical, fastener/hardware and sensor products.
