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Xilinx and Infineon are collaborating to offer power solutions for Zynq® UltraScale™+ MPSoC and RFSoC families
Munich, Germany – 26 February 2019 – Xilinx Inc. and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) have collaborated...
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Nexperia announces industry’s smallest logic parts approved for automotive
Up to 64% smaller than leaded devices Nijmegen, February 26, 2019: Nexperia, the global leader in discretes, logic and MOSFET...
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New Series of High-Side/Low-Side Gate Drivers from Diodes Incorporated Delivers Higher Performance in an SO-8 Package
Plano, Texas – February 26, 2019 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application...
Read moreQualcomm Hosts 30+ Industry Leaders to Celebrate Launch of 5G at Qualcomm’s booth in Mobile World Congress 2019
5G Industry Moment Celebration at MWC Gathers Executives from Operators, OEMs and Infrastructure Vendors WHAT: Qualcomm brings together industry leaders...
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Analog Devices Unveils SHARC® Audio Module Platform for Rapid Audio DSP Project Development
BANGALORE, India, February 26 2018. – Analog Devices, Inc. (ADI) announced today the availability of the SHARC® Audio Module (ADZS-SC589-MINI), a hardware/software...
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New panel mount, rugged C&K PT Series Sealed Power Toggle Switches – now available at TTI
Unique single-piece injection-moulded panel and toggle seal; IP66/IP68 variable February 2019 – The new PT Series of sealed power toggle switches...
Read moreMACOM and STMicroelectronics Accelerate GaN-on-Silicon Support for 5G Wireless Network Buildouts
Wafer supply expansion to enable cost, scale, and industrialization of GaN-on-Silicon for the global 5G network buildout Wide bandgap efficiency...
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