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Infineon Expands its Trusted Computing Expertise to Mobile Devices
OPTIGA™ TPM 2.0 Chips Secure Microsoft Surface Pro 3 Tablet Munich, Germany – February 6, 2015 – Infineon Technologies AG ...
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Littelfuse Introduces Low Capacitance ESD Protection TVS Diode Arrays Optimized for Fast-Charging Peripherals
0.3Ω dynamic resistance provides clamping voltages more than 23 percent lower than similar silicon solutions China, Beijing, February 10, 2015 — Littelfuse,...
Read moreAndroid is the most vulnerable mobile Operating System
Popular apps like Dropbox, Snapchat &, Uber have faced cyber-attacks in the past New Delhi, February 9, 2015: - Along...
Read moreMegaChips Utilizes Cadence Tensilica Xtensa Processor in Ultra-Low Power Internet of Things Sensor Hub IC
Xtensa Processor Selected After Competitive Benchmark Shows 90 Percent Lower Power Consumption for Arithmetic Operations SAN JOSE, Calif., February 9,...
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TI to drive innovation for IoT, industrial and automotive applications at embedded world 2015
Bangalore, 9th February 2015 — At embedded world in Nuremberg, Germany, Texas Instruments (TI) will demonstrate how its embedded processing and...
Read moreSTMicroelectronics Completes STMCube™ Flexible Fast-Start Software Platform, Supporting All STM32 Microcontrollers in Volume Production
nerates C initialization code that matches the user’s choices. In addition, it can also automatically download the corresponding embedded software....
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Telit Introduces CDMA Modules for the Energy Market
Single-band CE910-SLis a CDMA450 module for Utilities looking to manage their smart meters and assets in a private network New...
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