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ANSYS and Intel Spur Customer Innovation
Advances in engineering simulation software and Xeon technology dramatically reduce time for structural analysis investigations Bangalore, March 16, 2015 –...
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TI programmable MEMS chipset enables ultramobile analysis
New TI DLP® chipset enables twice the signal-to-noise ratio in the palm of your hand Bangalore, 13th March 2015 —...
Read moreSynopsys’ New Verification IP for MIPI Sound Wire Enables Audio and Control Interfaces in Low Power Designs
Native System Verilog-based VIP for Sound Wire Expands Portfolio of VIP for Mobile Applications and Offers Built-in Coverage, Verification Plan...
Read moreSTMicroelectronics Unveils New Automotive Serial EEPROMs Offering Industry’s Best Choice of Densities in Tiny 2x3mm Outline
New Delhi, March 13, 2015–Automotive-qualified serial EEPROMs from STMicroelectronics provide the industry’s largest selection of densities in the tiny 2mm...
Read moreInfineon Introduces OptiMOS™ 5 25V and 30V Product Family, Exceeding 95% Efficiency, Delivering Highest Power Density for Voltage Regulator Solutions
Infineon Technologies AG introduced the OptiMOS™ 5 25V and 30V product family, the next generation of Power MOSFETs in standard...
Read moreThinkRF Corporation, Canada signs VigVen Tech Mark Pvt Ltd as Distributor for India
ThinkRF Corporation, engaged in providing cost-effective, high-performance RF Receiver front ends, Tuners and Spectrum Anayzers today announced appointment of Bangalore...
Read moreTrina Solar to Supply 48 MW of Solar Modules to ACME India
New Delhi, 12th March 2015, Trina Solar Limited, a global leader in photovoltaic ("PV") modules, solutions and services, has signed...
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