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Realtek Accelerates System-on-Chip Verification with Cadence Palladium XP Platform
SAN JOSE, Calif., August 3, 2015— Cadence Design Systems, Inc. announced that Realtek Semiconductor Corp. utilized the Cadence® Palladium® XP platform...
Read moreMicrosemi Debuts Inductive Sensor Interface ICs
Aliso Viejo, Calif. -- Microsemi Corp. rolled out the first device in its new family of sensor interface integrated circuits...
Read moreON Semiconductor Introduces Series of Advanced Image Co-Processors for Next Generation Automotive Camera
New solutions deliver higher resolution, multiple interfaces and new automotive-targeted features for 1080p and 720p automotive rear view and surround...
Read moreASMPT 2015 Interim Profit Surges 26.0% Year-On-Year
Strong growth in revenue and profitability (Hong Kong, 30 July, 2015) − The world's No.1 semiconductor assembly and packaging equipment...
Read more15 engineers to build indoor vertical farms in element14’s new Vertical Farming design challenge
Participants will create IoT-enabled gardens and harvest crops with support from vertical farming facilities 301st July 2015, Bangalore – element14,...
Read moreMouser and Omron Announce Global Distribution Agreement
July 31, 2015 – Mouser Electronics, Inc. is pleased to announce a global distribution agreement with Omron Electronic Components, (headquartered...
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Harwin simplifies miniature EMC screening
Very low profile clips facilitate automated assembly Portsmouth, UK, July2015… Harwin, the leading hi-rel connector and SMT board hardware manufacturer,...
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