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ViaSat Opens New Research & Development Centre in Chennai, India
NEW DELHI, India – June 30, 2016 – ViaSat Inc., a global broadband services and technology company, today inaugurated its...
Read moreIAR Systems extends code analysis for applications based on Texas Instruments’ MSP430 MCUs
Uppsala, Sweden—June 30, 2016—IAR Systems® announces a new version of its development tools IAR Embedded Workbench® for Texas Instruments MSP430,...
Read moreFast, Compact Molex Nano-Pitch I/O Interconnect System Now Shipping from Mouser
June 30, 2016 – Mouser Electronics, Inc. is now stocking the Nano-Pitch I/O™ interconnect system from Molex, LLC. The system’s...
Read moreKDDI in Japan Selects Gemalto’s Connected Cars and IoT Solution
Solution includes remote subscription management and embedded SIM AMSTERDAM, June 30, 2016 - Gemalto (Euronext NL0000400653 GTO), the world leader...
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Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities
June 29, 2016 – Henkel Adhesive Technologies’ Electronics business has developed and launched the latest product in its line of...
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Allegro MicroSystems, LLC Announces New Three-Wire, True Zero-Speed, Surface Mount Magnetic Speed Sensor IC
Design Allows for Ease of Use for PCB Applications Over Typical SIP Based Packages Worcester, MA – June 2016 – In...
Read moreIEEE Experts Driven by Unconventional Inspiration Advance Technologies to Benefit Humanity
Innovations in Robotic Technology Improve Water Safety Rescues, Make Walking Easier for the Disabled and Deliver Dexterity and Accuracy to...
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