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NI Automated Test Outlook Reviews Test Approaches Needed in Era of Smart Devices
Guest Editor Dr. James Truchard examines top test and measurement trends Bangalore, India – January 5, 2017 – NI, the...
Read moreRetune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs
SAN JOSE, Calif., and COPENHAGEN, January 4, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) and Retune DSP today announced that Retune...
Read moreCadence and Dolby Collaborate to Enable the World’s First TVs Featuring Dolby Atmos Technology
Cadence Tensilica HiFi DSP for Audio Becomes First IP Core to Support MS12 v2.0 Multistream Decoder SAN JOSE, Calif., January...
Read moreTata Elxsi announces partnership with DISTI for feature-rich 3D automotive UX
LAS VEGAS, CES- 04 2017- Tata Elxsi, a leading global services design and technology services provider for the automotive industry,...
Read moreMediaTek Announces the MT2533D Chipset with Advanced Technology for Smart Headsets, Headphones and Hands-Free Systems
New MT2533D chipset technology delivers crystal-clear voice and music, combined with an ARM Cortex-M4 processor to enable smart device features...
Read moreBT and MediaTek Collaborate to Deliver Total Wireless Connectivity for the Home, and Connected World
Adaptive Network promises superior coverage and smart connectivity Bangalore, India – January 4, 2017–MediaTek today announced that BT has selected MediaTek’s...
Read moreMicrosemi Announces Two New Versions of its High Power TVS Devices to Address Demanding Lightning Protection Requirements in Aircraft
Company’s Unique PLAD Technology Enables Effective Surface-Mount TVS Packaging ALISO VIEJO, Calif.—Jan. 4, 2017—Microsemi Corporation (Nasdaq: MSCC), a leading provider...
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