TI introduces its highest speed and resolution DLP® chipset for 3D printing and lithography applications
Developers can now innovate with more than 4 million micromirrors to enable high throughput digital imaging applications Bangalore, Oct 7,...
Hong Kong: Ideal Platform for Indian Business Expansion
7 October 2015–Hong Kong Trade Development Council (HKTDC) Deputy Executive Director Benjamin Chau highlighted opportunities for Indian companies at the...
Imec and Cadence Complete Tapeout of First 5nm Test Chip
Cadence Innovus Implementation System Enables Optimal PPA for Advanced Designs LEUVEN, Belgium and SAN JOSE, Calif., October 7, 2015—Nano-electronics research center imec...
SiTime’s High-performance Oscillators Provide Timing for Lattice Semiconductor FPGA Development Boards
MEMS-based Oscillators Offer Ultimate Performance and Flexibility SUNNYVALE, Calif. – October 7, 2015 – SiTime Corporation, a MEMS and analog semiconductor company, today...
Mouser and Imahara Unveil New Driverless Cars Series and Help Drive the Latest Innovations in Autonomous Vehicle Technology
October 7, 2015 - Mouser Electronics, Inc. is teaming up with celebrity engineer Grant Imahara and a group of visionaries...
IAR Systems provides tools for new Atmel MPU series targeting industrial IoT and wearable application
IAR Embedded Workbench supports latest series of Atmel | SMART ARM Cortex-A5-based microprocessors with low power consumption and advanced security...
Industry’s lowest power Bluetooth Smart beacons achieve Eddystone certification
Eddystone parameters are configurable over the air MARIN, Switzerland, 7 October - Today, EM Microelectronic, the semiconductor company of the...
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