How to Cut the Cost of Certifier Upgrades
As many network installers look to upgrade their fleet of certifiers, IDEAL Networks claims that they can reduce costs by...
ViaSat Opens New Research & Development Centre in Chennai, India
NEW DELHI, India – June 30, 2016 – ViaSat Inc., a global broadband services and technology company, today inaugurated its...
IAR Systems extends code analysis for applications based on Texas Instruments’ MSP430 MCUs
Uppsala, Sweden—June 30, 2016—IAR Systems® announces a new version of its development tools IAR Embedded Workbench® for Texas Instruments MSP430,...
Fast, Compact Molex Nano-Pitch I/O Interconnect System Now Shipping from Mouser
June 30, 2016 – Mouser Electronics, Inc. is now stocking the Nano-Pitch I/O™ interconnect system from Molex, LLC. The system’s...
KDDI in Japan Selects Gemalto’s Connected Cars and IoT Solution
Solution includes remote subscription management and embedded SIM AMSTERDAM, June 30, 2016 - Gemalto (Euronext NL0000400653 GTO), the world leader...
Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities
June 29, 2016 – Henkel Adhesive Technologies’ Electronics business has developed and launched the latest product in its line of...
Allegro MicroSystems, LLC Announces New Three-Wire, True Zero-Speed, Surface Mount Magnetic Speed Sensor IC
Design Allows for Ease of Use for PCB Applications Over Typical SIP Based Packages Worcester, MA – June 2016 – In...
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