De-Paneling PCBs
Components and printed circuit boards are becoming smaller and more sensitive. When unassembled or assembled separate boards are de-paneled from...
Building and running a foundry requires expertise in the latest manufacturing technologies
Jaswinder Ahuja, Corporate Vice President & Managing Director, Cadence Design Systems (India) Pvt Ltd. Interview with...
Xilinx Demonstrates 56G PAM4 Transceiver Technology
Positioned for next generation high density 400G and terabit interfaces; Enabling the next wave of Ethernet deployment SAN JOSE, Calif.,...
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
Munich, Germany – March 11, 2016 – Infineon Technologies AG is growing the portfolio of CoolMOS™ CE with a SOT-223...
Su-Kam launches India’s Intelligent Home UPS ‘Falcon HBU’
Only home UPS in Indian market with 90% efficiency 4-star energy ratings by Bureau of Energy Efficiency (BEE) New Delhi,...
Matrix Launches Sparsh VP510E – Premium IP Phone For Smart Enterprises
Today’s enterprises associate business communication with intelligent features, speed of operations and ease of use. Matrix presents SPARSH VP510E, an...
Pasternack Introduces New Lines of 50 GHz and 67 GHz Millimeter Wave VNA Test Cables
Flexible Precision VNA Test Cables from Pasternack Provide Accurate and Repeatable Test Results to 67 GHz Irvine, CA - Pasternack,...
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