Registration for Worldwide MEMS Design Contest Opens
Cadence, X-FAB, Coventor and Reutlingen University offering a first prize of $5000 for leading-edge ingenuity in MEMS and mixed-signal designs...
Software-defined multi-device parallel testing of small cells
Mr. Tim Carey, Senior Product Manager for Modular Instruments at Cobham Wireless By Mr. Tim Carey,...
Vishay Intertechnology to Launch Vishay Resistors University
SHANGHAI — Nov. 2, 2016 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be launching the Vishay...
CUI Introduces High Performance Dc Fan Line to Bolster Thermal Management Portfolio
TUALATIN, Ore. — November 2, 2016 — CUI’s Components Group today announced the addition of a high performance dc fan line to...
Maxim Empowering Design Innovation at electronica 2016
Showcasing new and innovative solutions for Industry 4.0, Wearable Healthcare, and Automotive Applications MUNICH, Germany – November 2, 2016 –...
Microsemi Achieves MIL-STD-883 Class B Qualification for its RTG4 High-Speed Radiation-Tolerant FPGAs
RTG4 Space Flight Devices are Now Available in Various Screening Flows ALISO VIEJO, Calif.—Nov. 2, 2016—Microsemi Corporation (Nasdaq: MSCC), a...
Electronic components checkup by TQ
The TQ-Group offers printed circuit board (PCB) assembly checkups to customers and other interested parties. The checkup examines all components...
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