Five new MIL-COTS parts help simplify designs and optimize SWaP-C attributes
The VIADCM family are ruggedized modular DC-DC converters in a thermally adept, low profile (9.3mm)VIA package, with wide input voltage...
Marvell Introduces Industry’s First Wi-Fi, Bluetooth 5 and 802.11p Combo Solutions
Marvell extends a complete product portfolio of Ethernet and wireless automotive connectivity solutions with fourth generation family of wireless SoCs...
New SIPLACE TX micron: Improved Speed and Accuracy
ASM introduces a new and improved addition to the SIPLACE TX series - SIPLACE TX micron. This machine is equipped...
Premier Farnell, is “the Development Distributor”
Ralf Buehler, SVP Sales & Marketing, Premier Farnell An interview with Ralf Buehler, SVP Sales &...
Surface-Mount Intelligent Low-Power Modules from STMicroelectronics Save Space in Energy-Efficient Motor Drives
June 14, 2017 – STMicroelectronics has added five space-saving surface-mount intelligent power modules (IPM) to its SLLIMM™-nano family, giving the...
XP Power launches low profile 225 Watt power supply in compact 3”x5” U-channel format
June 13th 2017 – XP Power has announced the UCP225 series of high power density, very low profile 225W AC/DC...
New Line of Compact, Encapsulated Ac-Dc Power Supplies Ranging From 6 W to 20 W
TUALATIN, Ore. — June 13, 2017 — CUI’s Power Group today introduced a new line of low power, encapsulated ac-dc power supplies...
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