UBX-P3 is industry’s smallest concurrent dual-channel V2X communication chip
Thalwil, Switzerland – June 5, 2018 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, today announced its...
Mentor collaborates with THE GAIN to boost India’s ESDM startup ecosystem
Collaboration will focus on strategically accelerating India’s product engineering IP ecosystem by helping companies in the early stages of entrepreneurship...
Diodes Incorporated Introduces Industry-Leading, High-Speed, Multichannel Mux/Demux Signal Switch ICs, Clock Generators and Clock Buffers for PCIe® 4.0 Architecture and other Applications up to 20Gbps
Diodes Incorporated is at Booth 8 at the PCI-SIG Developers Conference, Santa Clara CA, June 5-6, 2018 Santa Clara, CA –...
FPAK56 MOSFETs from Nexperia feature improved creepage and clearance, meeting UL2595
Industry’s only available devices compatible with Power-SO8 footprint to meet new standard for battery-powered equipment Nijmegen, June 5, 2018: Nexperia,...
Nexperia launches lowest RDS(on) automotive MOSFETs down to 0.9 mΩ
High efficiency saves space and system cost; ultra-reliable for safety-critical designs Nijmegen, June 5, 2018: Nexperia, the global leader in...
ON Semiconductor Announces SiC Diodes for Demanding Automotive Applications
Lower losses and higher switching deliver highly efficient, space-saving solutions and reduced overall system costs PCIM 2018 – Hall 9...
Fuel Cells – Transforming Energy
By Mr. Abhishek Shukla, Marketing and Vendor Development, Saison Components & Solutions Fuel cells are no longer an “if” technology,...
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