Avaada Power inks pact to develop 500MW solar capacities in Andhra Pradesh
~ A step towards achieving state’s renewable capacity target of 18GW by 2021-22~ ~Commitment to invest NR 3,500 crores in...
Single output Logic dividers from Nexperia deliver space-saving of up to 93% for superior system efficiency
New range of overvoltage-tolerant AHC Logic dividers increase flexibility and reliability Nijmegen, February 27, 2018: Nexperia, the former Standard Products...
Cypress’ Latest Bluetooth WICED Evaluation Boards, Now at Mouser, Deliver Industry-Leading Performance for IoT
February 27, 2018 – Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now...
New Yorker Electronics Releases Supercapacitor with Massive Energy Storage Enabling New Design Options
Illinois Capacitor 350-Farad DGH Series of Supercapacitors offers Low ESR with Extended Life NORTHVALE, New Jersey, USA – New Yorker Electronics...
With Infineon XENSIV™ MEMS microphones: XMOS announces their new stereo-AEC far-field linear development kit for Amazon AVS
Munich, Germany, and Barcelona, Spain - 27 February 2018 - At Mobile World Congress, XMOS launched its VocalFusion™ Stereo Development...
Allegro MicroSystems, LLC introduces its first integrated, high sensitivity, current sensor IC for <5 AMP applications
Designed with Giant Magneto-Resistive (GMR) Ultra-Sensitive Technology Worcester, MA – February 27, 2018– Allegro MicroSystems, LLC introduces Allegro’s first fully...
10nm pattern generation using thermal scanning probe lithography enabled by simplified materials and processes
/ins Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation...
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