At Nepcon Shanghai 2015, the DEK printing team of ASM Assembly Systems was recognized for its innovative spirit and technical vision with two SMT China Vision Awards and two EM Asia Innovation Awards for the industry-leading DEK Gemini platform and the DEK UFP Eco cleaning fabric, which was developed especially for fast stencil cleaning in ultra-fine-pitch applications. The awards honor innovations that improve the quality and productivity of electronics manufacturers in Asia. Allen Huang and Rick Goldsmith of the DEK team received the awards at a ceremony during the 2015 Nepcon trade show in Shanghai.
According to the panel of journalists and selected technology specialists from universities and businesses, the DEK Gemini platform stood out because of the huge productivity gains that electronics manufacturers can achieve thanks to the platform’s dual-lane transport and compact design. They also gave special mention to the fact that users can change the setup on one lane while continuing to print with the other.
For its UFP Eco cleaning fabric, DEK developed a special surface structure with pockets that pick up solder paste residue and thus effectively prevent smudges on the stencil underside. The panel of the judges considered the new fabric to be a significant contribution to further improvements in process reliability and print quality in ultra-fine-pitch applications.
