ATLANTA, GA ― March 2016 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics packaging industries, today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms.
DIC is the industry standard for strain (CTE) measurements and Akrometrix’s unique dual camera approach provides unparalleled x-y strain metrology throughout a thermal profile from room temperature up to 300oC. With a resolution approaching 100 microstrains, the DIC solution is an optional module to Akrometrix’s AXP and PS200 shadow moiré systems.
The AXP and PS200S warpage and strain measurement systems, using both shadow moiré and digital image correlation (DIC), allow customers complete flexibility for both warpage and strain metrology on the same platform. “This modular approach substantially increases the capabilities of our systems while increasing the ROI on investments,” noted Neil Hubble, Akrometrix’s Director of Engineering.
