Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at NEPCON South China 2017, Aug. 29-31 in Shenzhen, China.
Indium Corporation is redefining solder with its InFORMS® solder preforms. InFORMS® are a composite preform consisting of solder and a reinforcing matrix. Together, lateral strength is increased and bondline co-planarity is improved. In addition, superior thermal cycling reliability can be achieved.
When InFORMS® were used to solder a DBC to the baseplate of an IGBT, one study showed:
- 4x improved thermal cycling reliability compared to a solder preform-only approach
- 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
- Reduced voiding (<1%)
- Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS® require no additional process steps or equipment
For more information about InFORMS®, visit www.indium.com/informs.
