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Home Spotlight

RD-500-III – BGA/SMT Rework System

Team Electronics by Team Electronics
March 26, 2014
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RD-500-III - BGA/SMT Rework System
RD-500-III – BGA/SMT Rework System

The RD-500 III is an advanced BGA Rework System. The system ensures stable and safe rework of BGA and SMD components. It has been designed for rework of lead free and eutectic solders and it can handle small as well as large PCBs.
The RD-500 comprises of a trouble-free internal flash memory hard drive. The system uses three separate heaters and suitable for lead free solder as well as conventional type. Long wave IR area heater is used to prevent PCB warping. The system offers two mode-cooling functions. Security lock-out function to prevent misuse. Two point component control auto-profiling. Convenient inspection function makes the system perfect for BGA applications. Five thermocouple inputs to monitor the temperature at key points during the process. The system is a fully integrated from solder cream application to component placement. This Semi-automatic system is useful for a wide variety of Rework.
The high resolution CCD Camera and prism fixed in the optic arm helps in precise alignment/ placement during rework process.
The maximum PCB size which can be handled is 500mm x 600mm and the system can handle devices as small as 2mm and up to maximum of 50 mm. The placement accuracy is +/- 0.025 mm. The temperature setting range is from 0 to 650 C.
For enquiries contact
M/s Qmax Test Technologies Pvt Ltd.,
6, ELCOT Avenue, IT Highway,
Sholinganallur, Chennai 600 119.
Phone : 044-24509627
Fax : 044-24509632
E-mail : sales@qmaxtest.com
Web : www.qmaxtest.com

Team Electronics

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