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Home Featured Articles

3D-MID,the demand is continuing

Electronics Maker by Electronics Maker
December 17, 2015
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Increase in production capacity

LDS (Laser Direct Structuring)Multiple Dimensions AGincreases its production capacities in Bruegg/Biel due to increased demand for Molded Interconnect Devices (MIDs) by a multiple.Additional high-tech lasersfor the structuring of the circuits onto the molded devices were purchased.With this expansion in capacity, Multiple Dimensions AG is underscoring its growth strategy.

Increasing applications in the automotive industry, as well as industries such as watches, medical, security, toys, consumer, and more confirm the continuing demand.

Maximum freedom in design

In using 3D-MIDs, product developers enjoy a freedom in design that Molded Interconnect Device technology provides.By designing circuits in three-dimensions, the resulting optimization of various functions take up a minimum amount of space and support miniaturization goals.For example, using the housing as the direct circuit carrier allows the reduction of connectivity components and simplifies assembly. The efforts in procurement, logistics, and quality assurance are significantly simplified.

Modern plant

The configuration of galvanic line 2, built especially for galvanizing the molded interconnected devices,is based on the long experience of the experts at Multiple Dimensions AG.The line is regarded as the most modern one of its kind.The galvanic lines together with the high tech lasers, the electronic plastic injection molding machines and additional systems form the modern production infrastructure at the site in Bruegg.

Quality assurance         

In the quality assurance department the precision of the molded interconnected parts is controlled with electronic coating measurement units (X-Rays), climatic chambers, and measuring microscopes.Samples and prototypes are measured in utmost detail.With a control and measurement plan created in partnership with each customer, Multiple Dimensions AG guaranties critical quality targets in volume production.

Multiple Dimensions AG – Your partner for molded interconnect devices (3D MIDs)

Multiple Dimensions is world’s leading technology enterprise specializing in the development of customized molded interconnect devices and their production. Multiple Dimensions AG maintains close partnerships with its customers across the entire process chain, from device design through large-scale series parts production. Multiple Dimensions AG is worldwide represented.

µltiple dimensions

3D-MID Technology

Multiple Dimensions AG

Erlenstrasse 44 | 2555 Bruegg | Switzerland / Main desk +41 32 552 07 50

catherine.knecht@multipledim.com | www.multipledim.com

 

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