CES 2016: 3D Image Sensor Chips REAL3™ of Infineon Bring Virtual Reality to the Smartphone
Munich and Siegen, Germany – December 17, 2015 – In the future, mobile devices will be able to quickly and ...
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Tag: Semiconductor & IC
Cadence Palladium Z1 addresses the verification and software development challenges from IP through sub-systems and SoCs
Frank Schirrmeister, Senior Director, Product Marketing, System and Software Realization Group,Cadence Design Systems Inc. Cadence Design ...
Read moreIAR Systems adds analysis functionality to tools for Renesas RL78
Support for the static analysis tool C-STAT, as well as stack usage analysis, is introduced by new release of IAR ...
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TI delivers first 16-cell integrated Li-ion monitor and protector for hybrids, electric vehicles and grid storage
Highly integrated battery management IC monitors up to 256 cells in series Bangalore, 18th December 2015 -- Texas Instruments (TI) ...
Read moreNew TDK ACT45L common-mode chokes for automotive Ethernet offer best noise suppression and smallest footprint on market – now available in Europe through TTI
Enables high-speed data transmission for modern Ethernetin-vehicle multimedia and infotainment systems December 2015–A new series of common-mode chokes from TDK ...
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Mouser Features the Latest Type-C and 3.1 on New USB Technology Site
December 17, 2015 - Mouser Electronics, Inc. today unveiled its newly designed USB Technology site, created to give engineers easy-to-access ...
Read moreDiodes Inc. AP9234L, Now at Mouser, Puts High-Accuracy Li+ Protection on Single Chip
December 16, 2015 – Mouser Electronics, Inc. is now stocking the new AP9234L battery protection IC from Diodes Incorporated. This ...
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