Indium Corporation Soldering Technology Expert to Present at IMPACT 2014

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), Oct. 22–24 in Taipei, Taiwan. Dr. Lee will present Voiding and Reliability of BGA Assemblies Produced with SAC and BiSnAg Solder…
Electrical Insulation Systems Testing

How do you know your electrical insulation system is effective? Experts from ELTEK International Laboratories will take to the stage at CWIEME Chicago 2014 to raise awareness of the latest technical developments in electrical insulation systems testing. Recent years have…
SMTA China Announces Winners of the 2014 Annual Awards

SMTA China held its annual awards presentation at the SMTA China Annual Award Ceremony, which took place on Tuesday, August 26, 2014 at the Shenzhen Convention & Exhibition Center. Alex Choi, Vice President of Shenzhen Kaifa Technology Co. Ltd. was…

DigiWorld Summit 2014 Date: 18th – 20th November  Venue: Montpellier, France Montpellier (France), 18 September 2014 – ‘‘Mobility reloaded” will be the central theme of the 36th annual DigiWorld Summit. Following through on ‘‘Game Changers’’ (2012) and ‘‘Digital Gold Mines’’ (2013),…
Honeywell to Showcase New Nanopower Series, Basic Board Mount Pressure Sensors and “Sensing Sensation” Displays at electronica Munich 2014

Offering Visitors Hands-on Experience to Learn Capabilities of Honeywell Sensors Showcasing the Industry’s first Nanopower Anisotropic Magnetoresistive Sensor ICs, Basic Board Mount Pressure Sensors Top Honeywell Experts Demonstrate Full Product Portfolio  ROLLE, SWITZERLAND – Sept.16, 2014 – Honeywell  will be showcasing…